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NCP1083
http://onsemi.com
17
PACKAGE DIMENSIONS
TSSOP20 EP
CASE 948AB01
ISSUE O
DIM
D
MIN
MAX
6.60
MILLIMETERS
E1
4.30
4.50
A
1.10
A1
0.05
0.15
L
0.50
0.70
e
0.65 BSC
P
---
4.20
c
0.09
0.20
c1
0.09
0.16
b
0.19
0.30
b1
0.19
0.25
L2
0.25 BSC
M
0
8
_    _
NOTES:
1.  DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2.  CONTROLLING DIMENSION: MILLIMETERS.
3.  DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.07 IN EXCESS OF THE LEAD WIDTH AT
MMC. DAMBAR CANNOT BE LOACTED ON THE
LOWER RADIUS OR THE FOOT OF THE LEAD.
4.  DIMENSIONS b, b1, c, c1 TO BE MEASURED BE-
TWEEN 0.10 AND 0.25 FROM LEAD TIP.
5.  DATUMS A AND B ARE ARE DETERMINED AT DATUM
H. DATUM H IS LOACTED AT THE MOLD PARTING
LINE AND COINCIDENT WITH LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY.
6.  DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION E1 DOES NOT
INCLUDE INTERLEAD FLASH OR PROTRUSION. IN-
TERLEAD FLASH OR PROTRUSION SHALL NOT EX-
CEED 0.15 PER SIDE. D AND E1 ARE DETERMINED
AT DATUM H.
PIN 1
REFERENCE
D
E1
0.08
A
SECTION BB
b
b1
c  c1
SEATING
PLANE
20X b
E
e
DETAIL A
6.40
---
4.30
20X
0.98
20X
0.35
0.65
DIMENSIONS: MILLIMETERS
PITCH
SOLDERING FOOTPRINT*
L
L2
GAUGE
DETAIL A
e/2
DETAIL B
A2
0.85
0.95
E
6.40 BSC
P1
---
3.00
PLANE
SEATING
PLANE
C
H
B
B
B
M
END VIEW
A-B
M
0.10
D
C
TOP VIEW
SIDE VIEW
A-B
0.20
D
C
1
10
11
20
B
A
D
DETAIL B
2X 10 TIPS
A1
A2
C
0.05
C
C
P
P1
BOTTOM VIEW
3.10
6.76
20X
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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